With the continuous iteration of technology, laser cutting has been widely and deeply applied in all walks of life, among which the largest share is laser cutting technology. The advantages of laser processing are high precision, high efficiency, narrow cutting seam and smooth cutting surface. At present, wood processing is an important application direction in laser cutting processing.
Laser cutting is essentially a non-contact thermal processing method. When cutting wood, it is easy to produce blackening phenomenon, that is, the wood edge is carbonized and blackened. Therefore, when setting the processing parameters, we can also adjust the parameters to avoid this phenomenon.
To avoid the carbonization effect of laser cutting, the laser speed should be increased and the laser power should be reduced as much as possible. However, it should be noted that many customers think that the faster the speed is, the better the power is. In order to reduce blackening, it is wrong to use high speed and low power for multiple cutting. After multiple cutting, the carbonization effect of wood may be darker than that of ordinary wood.
Although the power is reduced and the speed is increased, we still need to ensure that the wood is cut through at one time. Only on the basis of ensuring that the wood is cut through at one time, we can gradually increase the laser speed and reduce the laser power to avoid repeated processing and secondary burning. If the cut part is processed again, the blackening may become more serious.
The laser speed and laser power are also different, and the performance of different laser equipment is naturally different. When we try, we can first fix one of the parameters unchanged, then adjust the other parameter, and then repeat this step for several times.
Of course, the above methods are all based on the premise of thin wood processing. If the thick wood is 5mm or more, it is difficult for laser processing to avoid blackening. Of course, other processing methods can also be selected for processing thick plates. At this time, laser processing is not the optimal solution.